66AK2L06XCMS vs 66AK2L06XCMSA

This detailed comparison of 66AK2L06XCMS and 66AK2L06XCMSA in the Embedded - DSP (Digital Signal Processors) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

66AK2L06XCMS

66AK2L06XCMS

Texas Instruments

66AK2L06XCMSA

66AK2L06XCMSA

Texas Instruments

Specifications
Manufacturer Texas Instruments Texas Instruments
Package / Case 900-BFBGA, FCBGA 900-BFBGA, FCBGA
Description IC SOC MULTICORE DSP+ARM 900BGA IC SOC MULTICORE DSP+ARM 900BGA
In Stock 0 0
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series 66AK2Lx KeyStone Multicore 66AK2Lx KeyStone Multicore
Package Tray Tray
Type DSP+ARM® DSP+ARM®
Interface EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM
Clock Rate 1GHz 1GHz
Non-Volatile Memory ROM (384kB) ROM (384kB)
On-Chip RAM 5.384MB 5.384MB
Voltage - I/O 0.85V, 1.0V, 1.8V, 3.3V 0.85V, 1.0V, 1.8V, 3.3V
Voltage - Core Variable Variable
Operating Temperature 0°C ~ 100°C (TC) -40°C ~ 100°C (TC)
Supplier Device Package 900-FCBGA (25x25) 900-FCBGA (25x25)
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