9DB106BGILFT vs PI6CDBL401BZHIEX

This detailed comparison of 9DB106BGILFT and PI6CDBL401BZHIEX in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

9DB106BGILFT

9DB106BGILFT

Renesas Electronics America

PI6CDBL401BZHIEX

PI6CDBL401BZHIEX

Zetex Semiconductors (Diodes Inc.)

Specifications
Manufacturer Renesas Electronics America Zetex Semiconductors (Diodes Inc.)
Package / Case 28-TSSOP (0.173", 4.40mm Width) 32-WFQFN Exposed Pad
Description IC BUFFER ZD 6OUTPUT 28-TSSOP 3.3V 1:4 LOW POWER PCIE BUFFER
In Stock 5 183 300
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input Clock Clock
Output HCSL HCSL, LVDS
Number of Circuits 1 1
Ratio - Input:Output 1:6 1:4
Differential - Input:Output Yes/Yes Yes/Yes
Frequency - Max 105MHz 105MHz
Voltage - Supply 3.135V ~ 3.465V 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C (TA)
Supplier Device Package 28-TSSOP 32-TQFN (5x5)
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