9FGL6241AP301NDGI8 vs DSC557-0343SI1

This detailed comparison of 9FGL6241AP301NDGI8 and DSC557-0343SI1 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

9FGL6241AP301NDGI8

9FGL6241AP301NDGI8

Renesas Electronics America

DSC557-0343SI1

DSC557-0343SI1

Roving Networks / Microchip Technology

Specifications
Manufacturer Renesas Electronics America Roving Networks / Microchip Technology
Package / Case 28-VFQFN Exposed Pad 16-TSSOP (0.173", 4.40mm Width)
Description VFQFPN 4.00X4.00X0.90 MM, 0.40MM MEMS OSC XO 100.0000MHZ HCSL LVD
In Stock 87 000 710
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - DSC557-03
Package Tape & Reel (TR) Tube
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input Clock -
Output LP-HCSL, LVCMOS HCSL, LVDS
Number of Circuits 1 1
Ratio - Input:Output 3:2 0:2
Differential - Input:Output Yes/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 1.71V ~ 1.89V, 2.375V ~ 3.465V, 3.135V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C
Supplier Device Package 28-VFQFPN (4x4) -
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