ADG1609BCPZ-REEL7 vs HEF4053BP,652

This detailed comparison of ADG1609BCPZ-REEL7 and HEF4053BP,652 in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADG1609BCPZ-REEL7

ADG1609BCPZ-REEL7

Linear Technology (Analog Devices, Inc.)

HEF4053BP,652

HEF4053BP,652

NXP Semiconductors

Specifications
Manufacturer Linear Technology (Analog Devices, Inc.) NXP Semiconductors
Package / Case 16-WFQFN Exposed Pad, CSP 16-DIP (0.300", 7.62mm)
Description IC MULTIPLEXER DL 4X1 16LFCSP IC MUX/DEMUX TRIPLE 2X1 16DIP
In Stock 1 959 0
Mounting Type Surface Mount Through Hole
Part Status Active Obsolete
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tube
Switch Circuit SP4T SPDT
Multiplexer/Demultiplexer Circuit 4:1 2:1
Number of Circuits 2 3
On-State Resistance (Max) 4.5Ohm 155Ohm
Channel-to-Channel Matching (ΔRon) 120mOhm 5Ohm
Voltage - Supply, Single (V+) 3.3V ~ 16V 3V ~ 15V
Voltage - Supply, Dual (V±) ±3.3V ~ 8V -
Switch Time (Ton, Toff) (Max) 94ns, 93ns -
-3db Bandwidth 78MHz 70MHz
Charge Injection 29pC -
Channel Capacitance (CS(off), CD(off)) 19pF, 59pF 7.5pF
Current - Leakage (IS(off)) (Max) 100pA 200nA
Crosstalk -64dB @ 1MHz -50dB @ 1MHz
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 16-LFCSP-WQ (3x3) 16-DIP
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