ADG5434BCPZ-REEL7 vs TC74HC4052APF

This detailed comparison of ADG5434BCPZ-REEL7 and TC74HC4052APF in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADG5434BCPZ-REEL7

ADG5434BCPZ-REEL7

Linear Technology (Analog Devices, Inc.)

TC74HC4052APF

TC74HC4052APF

Toshiba Electronic Devices and Storage Corporation

Specifications
Manufacturer Linear Technology (Analog Devices, Inc.) Toshiba Electronic Devices and Storage Corporation
Package / Case 20-WFQFN Exposed Pad, CSP 16-DIP (0.300", 7.62mm)
Description IC SW ANLG QUAD SPDT 20LFCSP IC MUX/DEMUX DUAL 4X1 16DIP
In Stock 6 578 279
Mounting Type Surface Mount Through Hole
Part Status Active Active
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tube
Switch Circuit SPDT SP4T
Multiplexer/Demultiplexer Circuit 2:1 4:1
Number of Circuits 4 2
On-State Resistance (Max) 14Ohm 100Ohm
Channel-to-Channel Matching (ΔRon) 300mOhm 5Ohm
Voltage - Supply, Single (V+) 9V ~ 40V 2V ~ 6V
Voltage - Supply, Dual (V±) ±9V ~ 22V ±2V ~ 6V
Switch Time (Ton, Toff) (Max) 186ns, 104ns 18ns, 29ns (Typ)
-3db Bandwidth 140MHz 140MHz
Charge Injection 176pC -
Channel Capacitance (CS(off), CD(off)) 15pF, 23pF 2pF, 40pF
Current - Leakage (IS(off)) (Max) 250pA 100nA
Crosstalk -60dB @ 1MHz -50dB @ 1MHz
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 20-LFCSP-WQ (4x4) 16-DIP
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