ADGS1408BCPZ vs NX3L1G3157GW-Q100H

This detailed comparison of ADGS1408BCPZ and NX3L1G3157GW-Q100H in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADGS1408BCPZ

ADGS1408BCPZ

Linear Technology (Analog Devices, Inc.)

NX3L1G3157GW-Q100H

NX3L1G3157GW-Q100H

Flip Electronics

Specifications
Manufacturer Linear Technology (Analog Devices, Inc.) Flip Electronics
Package / Case 24-VFQFN Exposed Pad, CSP 6-TSSOP, SC-88, SOT-363
Description IC SWITCH SINGLE 24LFCSP ANALOG SWITCH ICS SNGL-POLE DBL-
In Stock 110 177
Mounting Type Surface Mount Surface Mount
Part Status Active Last Time Buy
Series * Automotive, AEC-Q100
Package Tray Tape & Reel (TR)
Switch Circuit - SPDT
Multiplexer/Demultiplexer Circuit 8:1 2:1
Number of Circuits 1 1
On-State Resistance (Max) 4.7Ohm 750mOhm
Channel-to-Channel Matching (ΔRon) 200mOhm 20mOhm
Voltage - Supply, Single (V+) 12V 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) ±15V -
Switch Time (Ton, Toff) (Max) 165ns, 155ns 25ns, 10ns
-3db Bandwidth 60MHz 60MHz
Charge Injection 50pC 15pC
Channel Capacitance (CS(off), CD(off)) 14pF, 80pF 35pF
Current - Leakage (IS(off)) (Max) 200pA 10nA
Crosstalk -70dB @ 1MHz -
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C (TA)
Supplier Device Package 24-LFCSP (4x4) 6-TSSOP
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