ADGS1408BCPZ vs NX3L2267SGU,115

This detailed comparison of ADGS1408BCPZ and NX3L2267SGU,115 in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADGS1408BCPZ

Linear Technology (Analog Devices, Inc.)

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NX3L2267SGU,115

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	Linear Technology (Analog Devices, Inc.)	NXP Semiconductors
Package / Case	24-VFQFN Exposed Pad, CSP	10-XFQFN
Description	IC SWITCH SINGLE 24LFCSP	IC ANALOG SWITCH SPDT 10XQFN
In Stock	110	3 957
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	*	-
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Switch Circuit	-	SPDT
Multiplexer/Demultiplexer Circuit	8:1	2:1
Number of Circuits	1	2
On-State Resistance (Max)	4.7Ohm	750mOhm
Channel-to-Channel Matching (ΔRon)	200mOhm	90mOhm
Voltage - Supply, Single (V+)	12V	1.4V ~ 4.3V
Voltage - Supply, Dual (V±)	±15V	-
Switch Time (Ton, Toff) (Max)	165ns, 155ns	40ns, 20ns
-3db Bandwidth	60MHz	60MHz
Charge Injection	50pC	37pC
Channel Capacitance (CS(off), CD(off))	14pF, 80pF	35pF
Current - Leakage (IS(off)) (Max)	200pA	10nA
Crosstalk	-70dB @ 1MHz	-90dB @ 100kHz
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C (TA)
Supplier Device Package	24-LFCSP (4x4)	10-XQFN (1.4x1.8)