ATSAM3X8EA-CU vs ATSAM3X4EA-CU

This detailed comparison of ATSAM3X8EA-CU and ATSAM3X4EA-CU in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3X8EA-CU

Roving Networks / Microchip Technology

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ATSAM3X4EA-CU

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	144-LFBGA	144-LFBGA
Description	IC MCU 32BIT 512KB FLASH 144BGA	IC MCU 32BIT 256KB FLASH 144BGA
In Stock	2 980	3 060
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3X	SAM3X
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	84MHz	84MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, Memory Card, SPI, SSC, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, Memory Card, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	103	103
Program Memory Size	512KB (512K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	100K x 8	68K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 16x12b; D/A 2x12b	A/D 16x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-BGA (13x13)	144-BGA (13x13)