ATSAMG55J19B-MUT vs ATSAMG55J19B-MU

This detailed comparison of ATSAMG55J19B-MUT and ATSAMG55J19B-MU in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAMG55J19B-MUT

ATSAMG55J19B-MUT

Roving Networks / Microchip Technology

ATSAMG55J19B-MU

ATSAMG55J19B-MU

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Description IC MCU 32BIT 512KB FLASH 64QFN IC MCU 32BIT 512KB FLASH 64QFN
In Stock 4 083 72
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series SAM G55 SAM G55
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tray
Core Processor ARM® Cortex®-M4 ARM® Cortex®-M4
Core Size 32-Bit 32-Bit
Speed 120MHz 120MHz
Connectivity I²C, SPI, UART/USART, USB I²C, SPI, UART/USART, USB
Peripherals DMA, I²S, POR, PWM, WDT DMA, I²S, POR, PWM, WDT
Number of I/O 48 48
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 176K x 8 176K x 8
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V 1.62V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-QFN (7.5x7.5) 64-QFN (7.5x7.5)
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