BD8153EFV-E2 vs MC34903CS3EK

This detailed comparison of BD8153EFV-E2 and MC34903CS3EK in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BD8153EFV-E2

ROHM Semiconductor

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MC34903CS3EK

VIGOR

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Specifications Hide identical items

Manufacturer	ROHM Semiconductor	VIGOR
Package / Case	24-VSSOP (0.220", 5.60mm Width) Exposed Pad	32-SSOP (0.295", 7.50mm Width) Exposed Pad
Description	IC POWER SUP VARI 4CH HTSSOP-B24	SYSTEM BASIS CHIP, LIN, 2X 3.3 V
In Stock	1 938	76
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	-	-
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Bulk
Applications	TFT-LCD Monitors	System Basis Chip
Current - Supply	2mA	2mA
Voltage - Supply	2.1V ~ 6V	5.5V ~ 28V
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C
Supplier Device Package	24-HTSSOP-B	32-SOIC-EP