BD8153EFV-E2 vs TEA2208T/1J

This detailed comparison of BD8153EFV-E2 and TEA2208T/1J in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BD8153EFV-E2

BD8153EFV-E2

ROHM Semiconductor

TEA2208T/1J

TEA2208T/1J

NXP Semiconductors

Specifications
Manufacturer ROHM Semiconductor NXP Semiconductors
Package / Case 24-VSSOP (0.220", 5.60mm Width) Exposed Pad 14-SOIC (0.154", 3.90mm Width)
Description IC POWER SUP VARI 4CH HTSSOP-B24 BRIDGE RECTIFIER CONTROLLER S014
In Stock 1 938 2 390
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Applications TFT-LCD Monitors Desktop, Notebook PCs
Current - Supply 2mA 2mA
Voltage - Supply 2.1V ~ 6V 0V ~ 440V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C (TJ)
Supplier Device Package 24-HTSSOP-B 14-SO
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