BR25G1MF-3GE2 vs BR25G512F-3GE2

This detailed comparison of BR25G1MF-3GE2 and BR25G512F-3GE2 in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BR25G1MF-3GE2

ROHM Semiconductor

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BR25G512F-3GE2

ROHM Semiconductor

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Specifications Hide identical items

Manufacturer	ROHM Semiconductor	ROHM Semiconductor
Package / Case	8-SOIC (0.173", 4.40mm Width)	8-SOIC (0.173", 4.40mm Width)
Description	IC EEPROM 1MBIT SPI 10MHZ 8SOP	IC EEPROM 512KBIT SPI 10MHZ 8SOP
In Stock	2 440	2 380
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	-	-
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Memory Type	Non-Volatile	Non-Volatile
Memory Format	EEPROM	EEPROM
Technology	EEPROM	EEPROM
Memory Size	1Mb (128K x 8)	512Kb (64K x 8)
Memory Interface	SPI	SPI
Clock Frequency	10 MHz	10 MHz
Write Cycle Time - Word, Page	5ms	5ms
Access Time	-	-
Voltage - Supply	1.8V ~ 5.5V	1.8V ~ 5.5V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-SOP	8-SOP