BR25A512FVT-3MGE2 vs BR25G512FVT-3GE2

This detailed comparison of BR25A512FVT-3MGE2 and BR25G512FVT-3GE2 in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BR25A512FVT-3MGE2

ROHM Semiconductor

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BR25G512FVT-3GE2

ROHM Semiconductor

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Specifications Hide identical items

Manufacturer	ROHM Semiconductor	ROHM Semiconductor
Package / Case	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)
Description	IC EEPROM 512KBIT SPI 8TSSOP	IC EEPROM 512KBIT SPI 8TSSOP
In Stock	2 954	3 431
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	-	-
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Memory Type	Non-Volatile	Non-Volatile
Memory Format	EEPROM	EEPROM
Technology	EEPROM	EEPROM
Memory Size	512Kb (64K x 8)	512Kb (64K x 8)
Memory Interface	SPI	SPI
Clock Frequency	10 MHz	10 MHz
Write Cycle Time - Word, Page	5ms	5ms
Access Time	-	-
Voltage - Supply	2.5V ~ 5.5V	1.8V ~ 5.5V
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-TSSOP-B	8-TSSOP-B