BR25H128F-2LBH2 vs BR25H160F-2CE2

This detailed comparison of BR25H128F-2LBH2 and BR25H160F-2CE2 in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BR25H128F-2LBH2

BR25H128F-2LBH2

ROHM Semiconductor

BR25H160F-2CE2

BR25H160F-2CE2

ROHM Semiconductor

Specifications
Manufacturer ROHM Semiconductor ROHM Semiconductor
Package / Case 8-SOIC (0.173", 4.40mm Width) 8-SOIC (0.173", 4.40mm Width)
Description IC EEPROM 128KBIT SPI 10MHZ 8SOP IC EEPROM 16KBIT SPI 10MHZ 8SOP
In Stock 242 2 124
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - Automotive, AEC-Q100
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Memory Type Non-Volatile Non-Volatile
Memory Format EEPROM EEPROM
Technology EEPROM EEPROM
Memory Size 128Kb (16K x 8) 16Kb (2K x 8)
Memory Interface SPI SPI
Clock Frequency 10 MHz 10 MHz
Write Cycle Time - Word, Page 4ms 4ms
Access Time - -
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 8-SOP 8-SOP
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