BR25L040FVJ-WE2 vs BR93G66FVJ-3AGTE2

This detailed comparison of BR25L040FVJ-WE2 and BR93G66FVJ-3AGTE2 in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BR25L040FVJ-WE2

ROHM Semiconductor

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BR93G66FVJ-3AGTE2

ROHM Semiconductor

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Specifications Hide identical items

Manufacturer	ROHM Semiconductor	ROHM Semiconductor
Package / Case	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Description	IC EEPROM 4KBIT SPI 5MHZ 8TSSOP	IC EEPROM 4KBIT SPI 3MHZ 8TSSOP
In Stock	2 500	2 500
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Active
Series	-	-
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Memory Type	Non-Volatile	Non-Volatile
Memory Format	EEPROM	EEPROM
Technology	EEPROM	EEPROM
Memory Size	4Kb (512 x 8)	4Kb (256 x 16)
Memory Interface	SPI	SPI
Clock Frequency	5 MHz	3 MHz
Write Cycle Time - Word, Page	5ms	5ms
Access Time	-	-
Voltage - Supply	1.8V ~ 5.5V	1.7V ~ 5.5V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-TSSOP-BJ	8-TSSOP-BJ