BR25L080FVT-WE2 vs BR93G76FVT-3GE2

This detailed comparison of BR25L080FVT-WE2 and BR93G76FVT-3GE2 in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BR25L080FVT-WE2

BR25L080FVT-WE2

ROHM Semiconductor

BR93G76FVT-3GE2

BR93G76FVT-3GE2

ROHM Semiconductor

Specifications
Manufacturer ROHM Semiconductor ROHM Semiconductor
Package / Case 8-TSSOP (0.173", 4.40mm Width) 8-TSSOP (0.173", 4.40mm Width)
Description IC EEPROM 8KBIT SPI 5MHZ 8TSSOPB IC EEPROM 8KBIT SPI 3MHZ 8TSSOPB
In Stock 296 2 995
Mounting Type Surface Mount Surface Mount
Part Status Not For New Designs Active
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Memory Type Non-Volatile Non-Volatile
Memory Format EEPROM EEPROM
Technology EEPROM EEPROM
Memory Size 8Kb (1K x 8) 8Kb (1K x 8, 512 x 16)
Memory Interface SPI SPI
Clock Frequency 5 MHz 3 MHz
Write Cycle Time - Word, Page 5ms 5ms
Access Time - -
Voltage - Supply 1.8V ~ 5.5V 1.7V ~ 5.5V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 8-TSSOP-B 8-TSSOP-B
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