BR25L160FVT-WE2 vs BR93G86FVT-3AGE2

This detailed comparison of BR25L160FVT-WE2 and BR93G86FVT-3AGE2 in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BR25L160FVT-WE2

ROHM Semiconductor

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BR93G86FVT-3AGE2

ROHM Semiconductor

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Specifications Hide identical items

Manufacturer	ROHM Semiconductor	ROHM Semiconductor
Package / Case	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)
Description	IC EEPROM 16KBIT SPI 8TSSOPB	IC EEPROM 16KBIT SPI 8TSSOPB
In Stock	108	2 335
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Active
Series	-	-
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Memory Type	Non-Volatile	Non-Volatile
Memory Format	EEPROM	EEPROM
Technology	EEPROM	EEPROM
Memory Size	16Kb (2K x 8)	16Kb (1K x 16)
Memory Interface	SPI	SPI
Clock Frequency	5 MHz	3 MHz
Write Cycle Time - Word, Page	5ms	5ms
Access Time	-	-
Voltage - Supply	1.8V ~ 5.5V	1.7V ~ 5.5V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-TSSOP-B	8-TSSOP-B