CY9BF315NBGL-GE1 vs CY9AF315NABGL-GE1

This detailed comparison of CY9BF315NBGL-GE1 and CY9AF315NABGL-GE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CY9BF315NBGL-GE1

CY9BF315NBGL-GE1

Cypress Semiconductor

CY9AF315NABGL-GE1

CY9AF315NABGL-GE1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 112-LFBGA 112-LFBGA
Description IC MCU 32BIT 416KB FLSH 112PFBGA IC MCU 32BIT 384KB FLSH 112PFBGA
In Stock 2 418 2 909
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series FM3 MB9B310R FM3 MB9A310A
Package Tray Tray
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit 32-Bit
Speed 144MHz 40MHz
Connectivity CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 83 83
Program Memory Size 416KB (416K x 8) 384KB (384K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 48K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 112-PFBGA (10x10) 112-PFBGA (10x10)
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