CY9EF226PMC-GSE2 vs MB9EF226BPMC-GSE2-HTV

This detailed comparison of CY9EF226PMC-GSE2 and MB9EF226BPMC-GSE2-HTV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CY9EF226PMC-GSE2

CY9EF226PMC-GSE2

Cypress Semiconductor

MB9EF226BPMC-GSE2-HTV

MB9EF226BPMC-GSE2-HTV

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 176-LQFP 176-LQFP
Description IC MCU 32BIT 2MB FLASH 176LQFP IC MCU 32BIT 2MB FLASH 176LQFP
In Stock 0 3 997
Mounting Type Surface Mount Surface Mount
Part Status Last Time Buy Obsolete
Series FCR4 MB9EF226 -
Package Tray Tray
Core Processor ARM® Cortex®-R4 ARM® Cortex®-R4
Core Size 32-Bit 32-Bit
Speed 128MHz 128MHz
Connectivity CANbus, I²C, LINbus, SPI, UART/USART CANbus, I²C, LINbus, SPI, UART/USART
Peripherals DMA, I²S, LVD, POR, PWM, WDT DMA, I²S, LVD, POR, PWM, WDT
Number of I/O 117 117
Program Memory Size 2MB (2M x 8) 2MB (2M x 8)
Program Memory Type FLASH FLASH
EEPROM Size 48K x 8 -
RAM Size 208K x 8 208K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 5.5V 1.1V ~ 5.5V
Data Converters A/D 50x10b A/D 50x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 176-LQFP (24x24) 176-LQFP (24x24)
Part Number Manufacturer Description Request For Quote
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