D6417760BL200ADV vs HD6417760BL200AV

This detailed comparison of D6417760BL200ADV and HD6417760BL200AV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

D6417760BL200ADV

D6417760BL200ADV

Renesas Electronics America

HD6417760BL200AV

HD6417760BL200AV

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 256-LFBGA 256-LFBGA
Description IC MCU 32BIT ROMLESS 256LFBGA IC MCU 32BIT ROMLESS 256LFBGA
In Stock 123 185
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series SuperH® SH7750 SuperH® SH7750
Package Tray Tray
Core Processor SH-4 SH-4
Core Size 32-Bit 32-Bit
Speed 200MHz 200MHz
Connectivity Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals DMA, LCD, POR, WDT DMA, LCD, POR, WDT
Number of I/O 69 69
Program Memory Size - -
Program Memory Type ROMless ROMless
EEPROM Size - -
RAM Size 48K x 8 48K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 1.6V 1.4V ~ 1.6V
Data Converters A/D 4x10b A/D 4x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 256-LFBGA (17x17) 256-LFBGA (17x17)
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