DF3026X25V vs DF3026XBL25V

This detailed comparison of DF3026X25V and DF3026XBL25V in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF3026X25V

DF3026X25V

Renesas Electronics America

DF3026XBL25V

DF3026XBL25V

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 100-TQFP 100-TQFP
Description IC MCU 16BIT 256KB FLASH 100TQFP IC MCU 16BIT 256KB FLASH 100TQFP
In Stock 297 184
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series H8® H8/300H H8® H8/300H
Package Tray Tray
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 25MHz 25MHz
Connectivity SCI, SmartCard SCI, SmartCard
Peripherals PWM, WDT PWM, WDT
Number of I/O 70 70
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 8K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Supplier Device Package - -
Part Number Manufacturer Description Request For Quote
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MC908EY8VFAE NXP Semiconductors IC MCU 8BIT 8KB FLASH 32LQFP
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