DSC557-0333FI1T vs 9FGL6241AP301NDGI

This detailed comparison of DSC557-0333FI1T and 9FGL6241AP301NDGI in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0333FI1T

DSC557-0333FI1T

Roving Networks / Microchip Technology

9FGL6241AP301NDGI

9FGL6241AP301NDGI

Renesas Electronics America

Specifications
Manufacturer Roving Networks / Microchip Technology Renesas Electronics America
Package / Case 14-VFQFN Exposed Pad 28-VFQFN Exposed Pad
Description 2-OUTPUT MEMS PCIE GEN1/2/3/4 CL VFQFPN 4.00X4.00X0.90 MM, 0.40MM
In Stock 145 87 000
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tray
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - Clock
Output HCSL, LVCMOS, LVDS LP-HCSL, LVCMOS
Number of Circuits 1 1
Ratio - Input:Output 1:2 3:2
Differential - Input:Output No/Yes Yes/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 1.71V ~ 1.89V, 2.375V ~ 3.465V, 3.135V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C (TA)
Supplier Device Package 14-QFN (2.5x3.2) 28-VFQFPN (4x4)
Top