DSC557-0333FI1T vs DSC557-053344KL1T

This detailed comparison of DSC557-0333FI1T and DSC557-053344KL1T in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0333FI1T

DSC557-0333FI1T

Roving Networks / Microchip Technology

DSC557-053344KL1T

DSC557-053344KL1T

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 14-VFQFN Exposed Pad 20-VFQFN Exposed Pad
Description 2-OUTPUT MEMS PCIE GEN1/2/3/4 CL MEMS OSC XO 100.0000MHZ HCSL LVD
In Stock 145 277
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 DSC557-05
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - -
Output HCSL, LVCMOS, LVDS HCSL, LVDS
Number of Circuits 1 1
Ratio - Input:Output 1:2 0:4
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 105°C
Supplier Device Package 14-QFN (2.5x3.2) -
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