DSPIC30F3012-20I/P vs DSPIC30F3012-20E/P

This detailed comparison of DSPIC30F3012-20I/P and DSPIC30F3012-20E/P in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC30F3012-20I/P

DSPIC30F3012-20I/P

Roving Networks / Microchip Technology

DSPIC30F3012-20E/P

DSPIC30F3012-20E/P

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 18-DIP (0.300", 7.62mm) 18-DIP (0.300", 7.62mm)
Description IC MCU 16BIT 24KB FLASH 18DIP IC MCU 16BIT 24KB FLASH 18DIP
In Stock 188 243
Mounting Type Through Hole Through Hole
Part Status Active Active
Series dsPIC™ 30F dsPIC™ 30F
Package Tube Tube
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 20 MIPS 20 MIPS
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 12 12
Program Memory Size 24KB (8K x 24) 24KB (8K x 24)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 1K x 8
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2.5V ~ 5.5V 2.5V ~ 5.5V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 18-PDIP 18-PDIP
Part Number Manufacturer Description Request For Quote
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