DSPIC33EP256GM306-I/MR vs DSPIC33EP256GM306T-I/MR

This detailed comparison of DSPIC33EP256GM306-I/MR and DSPIC33EP256GM306T-I/MR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP256GM306-I/MR

Roving Networks / Microchip Technology

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DSPIC33EP256GM306T-I/MR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 16BIT 256KB FLASH 64VQFN	IC MCU 16BIT 256KB FLASH 64VQFN
In Stock	141	315
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	dsPIC™ 33EP	dsPIC™ 33EP
Package	Tube	Tape & Reel (TR)
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	70 MIPs	70 MIPs
Connectivity	I²C, IrDA, LINbus, QEI, SPI, UART/USART	I²C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O	53	53
Program Memory Size	256KB (85.5K x 24)	256KB (85.5K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	32K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	-
Data Converters	A/D 30x10b/12b	A/D 30x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-VQFN (9x9)	64-VQFN (9x9)