DSPIC33EP256GM706-H/MR vs DSPIC33EP256GM706-H/PT

This detailed comparison of DSPIC33EP256GM706-H/MR and DSPIC33EP256GM706-H/PT in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP256GM706-H/MR

DSPIC33EP256GM706-H/MR

Roving Networks / Microchip Technology

DSPIC33EP256GM706-H/PT

DSPIC33EP256GM706-H/PT

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Description IC MCU 16BIT 256KB FLASH 64VQFN IC MCU 16BIT 256KB FLASH 64VQFN
In Stock 274 506
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Automotive, AEC-Q100, dsPIC™ 33EP Automotive, AEC-Q100, dsPIC™ 33EP
Package Tube Tray
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed - -
Connectivity CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 53 53
Program Memory Size 256KB (85.5K x 24) 256KB (85.5K x 24)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) - -
Data Converters A/D 30x10b/12b A/D 30x10b/12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 150°C (TA) -40°C ~ 150°C (TA)
Supplier Device Package 64-VQFN (9x9) 64-VQFN (9x9)
Part Number Manufacturer Description Request For Quote
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MB91F467SAPMC-C0017 Cypress Semiconductor IC MCU 32B 1.0625MB FLSH 176LQFP
CY8C29666-24LFXIT Cypress Semiconductor IC MCU 8BIT 32KB FLASH 48QFN
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