DSPIC33EP256GP502-I/SP vs DSPIC33EP256GP502-E/SP

This detailed comparison of DSPIC33EP256GP502-I/SP and DSPIC33EP256GP502-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP256GP502-I/SP

DSPIC33EP256GP502-I/SP

Roving Networks / Microchip Technology

DSPIC33EP256GP502-E/SP

DSPIC33EP256GP502-E/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 16BIT 256KB FLASH 28SPDIP IC MCU 16BIT 256KB FLASH 28SPDIP
In Stock 137 650
Mounting Type Through Hole Through Hole
Part Status Active Active
Series dsPIC™ 33EP Automotive, AEC-Q100, dsPIC™ 33EP
Package Tube Tube
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 70 MIPs 60 MIPs
Connectivity CANbus, I²C, IrDA, LINbus, SPI, UART/USART CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 21 21
Program Memory Size 256KB (85.5K x 24) 256KB (85.5K x 24)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 16K x 16 16K x 16
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 6x10b/12b A/D 6x10b/12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
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