DSPIC33EP256GP504-I/ML vs DSPIC33EP256GP504-E/ML

This detailed comparison of DSPIC33EP256GP504-I/ML and DSPIC33EP256GP504-E/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP256GP504-I/ML

Roving Networks / Microchip Technology

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DSPIC33EP256GP504-E/ML

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	44-VQFN Exposed Pad	44-VQFN Exposed Pad
Description	IC MCU 16BIT 256KB FLASH 44QFN	IC MCU 16BIT 256KB FLASH 44QFN
In Stock	256	507
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	dsPIC™ 33EP	Automotive, AEC-Q100, dsPIC™ 33EP
Package	Tube	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	70 MIPs	60 MIPs
Connectivity	CANbus, I²C, IrDA, LINbus, SPI, UART/USART	CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	35	35
Program Memory Size	256KB (85.5K x 24)	256KB (85.5K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	16K x 16	16K x 16
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 9x10b/12b	A/D 9x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	44-QFN (8x8)	44-QFN (8x8)