DSPIC33EP32GP502-E/SP vs DSPIC33EP32GP502-H/SP

This detailed comparison of DSPIC33EP32GP502-E/SP and DSPIC33EP32GP502-H/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP32GP502-E/SP

Roving Networks / Microchip Technology

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DSPIC33EP32GP502-H/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 16BIT 32KB FLASH 28SPDIP	IC MCU 16BIT 32KB FLASH 28SPDIP
In Stock	556	125
Mounting Type	Through Hole	Through Hole
Part Status	Active	Obsolete
Series	Automotive, AEC-Q100, dsPIC™ 33EP	Automotive, AEC-Q100, dsPIC™ 33EP
Package	Tube	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	60 MIPs	60 MIPs
Connectivity	CANbus, I²C, IrDA, LINbus, SPI, UART/USART	CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	21	21
Program Memory Size	32KB (10.7K x 24)	32KB (10.7K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 16	2K x 16
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 6x10b/12b	A/D 6x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 150°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP