DSPIC33EP64GS502-I/MM vs DSPIC33EP64GS502T-E/MM

This detailed comparison of DSPIC33EP64GS502-I/MM and DSPIC33EP64GS502T-E/MM in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP64GS502-I/MM

DSPIC33EP64GS502-I/MM

Roving Networks / Microchip Technology

DSPIC33EP64GS502T-E/MM

DSPIC33EP64GS502T-E/MM

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-VQFN Exposed Pad 28-VQFN Exposed Pad
Description IC MCU 16BIT 64KB FLASH 28QFN IC MCU 16BIT 64KB FLASH 28QFN
In Stock 323 236
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series dsPIC™ 33EP, Functional Safety (FuSa) Automotive, AEC-Q100, dsPIC™ 33EP, Functional Safety (FuSa)
Package Tube Tape & Reel (TR)
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 70 MIPs 60 MIPs
Connectivity I²C, IrDA, LINbus, SPI, UART/USART I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 21 21
Program Memory Size 64KB (64K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 8K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 12x12b; D/A 1x12b A/D 12x12b; D/A 1x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 28-QFN-S (6x6) 28-QFN-S (6x6)
Part Number Manufacturer Description Request For Quote
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