DSPIC33EV32GM006-I/MR vs DSPIC33EV32GM006-E/MR

This detailed comparison of DSPIC33EV32GM006-I/MR and DSPIC33EV32GM006-E/MR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EV32GM006-I/MR

DSPIC33EV32GM006-I/MR

Roving Networks / Microchip Technology

DSPIC33EV32GM006-E/MR

DSPIC33EV32GM006-E/MR

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Description IC MCU 16BIT 32KB FLASH 64VQFN IC MCU 16BIT 32KB FLASH 64VQFN
In Stock 783 129
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series dsPIC™ 33EV, Functional Safety (FuSa) Automotive, AEC-Q100, dsPIC™ 33EV, Functional Safety (FuSa)
Package Tube Tube
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 70 MIPs 60 MIPs
Connectivity I²C, IrDA, LINbus, SPI, UART/USART I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O 53 53
Program Memory Size 32KB (11K x 24) 32KB (11K x 24)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Data Converters A/D 36x10/12b A/D 36x10/12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 64-VQFN (9x9) 64-VQFN (9x9)
Part Number Manufacturer Description Request For Quote
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