DSPIC33FJ16GS502-I/SP vs DSPIC33FJ16GS502-50I/SP

This detailed comparison of DSPIC33FJ16GS502-I/SP and DSPIC33FJ16GS502-50I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33FJ16GS502-I/SP

DSPIC33FJ16GS502-I/SP

Roving Networks / Microchip Technology

DSPIC33FJ16GS502-50I/SP

DSPIC33FJ16GS502-50I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 16BIT 16KB FLASH 28SPDIP IC MCU 16BIT 16KB FLASH 28SPDIP
In Stock 624 133
Mounting Type Through Hole Through Hole
Part Status Active Active
Series dsPIC™ 33F dsPIC™ 33F
Package Tube Tube
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 40 MIPs 50 MIPs
Connectivity I²C, IrDA, LINbus, SPI, UART/USART I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 21 21
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 16x10b; D/A 4x10b A/D 16x10b; D/A 4x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
Part Number Manufacturer Description Request For Quote
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