EP3SL200F1152I4L vs EP3SL200F1152I4NAE

This detailed comparison of EP3SL200F1152I4L and EP3SL200F1152I4NAE in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

EP3SL200F1152I4L

Intel

EP3SL200F1152I4NAE

Intel

Specifications Hide identical items

Manufacturer	Intel	Intel
Package / Case	1152-BBGA, FCBGA	1152-BBGA, FCBGA
Description	IC FPGA 744 I/O 1152FBGA	IC FPGA STRATIX III FLIP CHIP
In Stock	490	605
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	Stratix® III L	Stratix® III L
Package	Tray	Tray
Number of LABs/CLBs	8000	80000
Number of Logic Elements/Cells	200000	200000
Total RAM Bits	10901504	10901504
Number of I/O	744	744
Number of Gates	-	-
Voltage - Supply	0.86V ~ 1.15V	0.86V ~ 1.15V
Operating Temperature	-40°C ~ 100°C (TJ)	-40°C ~ 100°C (TJ)
Supplier Device Package	1152-FBGA (35x35)	1152-FBGA (35x35)

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