DF3067RFI20V vs HD64F3062BFBL25V

This detailed comparison of DF3067RFI20V and HD64F3062BFBL25V in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF3067RFI20V

DF3067RFI20V

Renesas Electronics America

HD64F3062BFBL25V

HD64F3062BFBL25V

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 100-BFQFP 100-BFQFP
Description IC MCU 16BIT 128KB FLASH 100QFP IC MCU 16BIT 128KB FLASH 100QFP
In Stock 944 240
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series H8® H8/300H H8® H8/300H
Package Bulk Tray
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 20MHz 25MHz
Connectivity SCI, SmartCard SCI, SmartCard
Peripherals DMA, PWM, WDT DMA, PWM, WDT
Number of I/O 70 70
Program Memory Size 128KB (128K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -20°C ~ 75°C (TA)
Supplier Device Package 100-QFP (14x14) 100-QFP (14x14)
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