HD64F3670FXIV vs HD64F3670FYV

This detailed comparison of HD64F3670FXIV and HD64F3670FYV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

HD64F3670FXIV

Renesas Electronics America

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HD64F3670FYV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	48-LQFP	48-LQFP
Description	IC MCU 16BIT 8KB FLASH 48LQFP	IC MCU 16BIT 8KB FLASH 48LQFP
In Stock	606	451
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	H8® H8/300H Tiny	H8® H8/300H Tiny
Package	Tray	Tray
Core Processor	H8/300H	H8/300H
Core Size	16-Bit	16-Bit
Speed	16MHz	16MHz
Connectivity	SCI	SCI
Peripherals	PWM, WDT	PWM, WDT
Number of I/O	26	26
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 4x10b	A/D 4x10b
Oscillator Type	External	External
Operating Temperature	-20°C ~ 75°C (TA)	-20°C ~ 75°C (TA)
Supplier Device Package	48-LQFP (10x10)	48-LQFP (10x10)