HD64F3684GDV vs HD64F3687GDV

This detailed comparison of HD64F3684GDV and HD64F3687GDV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

HD64F3684GDV

HD64F3684GDV

Renesas Electronics America

HD64F3687GDV

HD64F3687GDV

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 64-QFP 64-QFP
Description IC MCU 16BIT 32KB FLASH 64QFP IC MCU 16BIT 56KB FLASH 64QFP
In Stock 634 897
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series H8® H8/300H Tiny H8® H8/300H Tiny
Package Tray Tray
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 20MHz 20MHz
Connectivity I²C, SCI I²C, SCI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 45 45
Program Memory Size 32KB (32K x 8) 56KB (56K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Supplier Device Package - -
Part Number Manufacturer Description Request For Quote
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