HEF4053BP,652 vs ADG1609BCPZ-REEL7

This detailed comparison of HEF4053BP,652 and ADG1609BCPZ-REEL7 in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

HEF4053BP,652

HEF4053BP,652

NXP Semiconductors

ADG1609BCPZ-REEL7

ADG1609BCPZ-REEL7

Linear Technology (Analog Devices, Inc.)

Specifications
Manufacturer NXP Semiconductors Linear Technology (Analog Devices, Inc.)
Package / Case 16-DIP (0.300", 7.62mm) 16-WFQFN Exposed Pad, CSP
Description IC MUX/DEMUX TRIPLE 2X1 16DIP IC MULTIPLEXER DL 4X1 16LFCSP
In Stock 0 1 959
Mounting Type Through Hole Surface Mount
Part Status Obsolete Active
Series - -
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Switch Circuit SPDT SP4T
Multiplexer/Demultiplexer Circuit 2:1 4:1
Number of Circuits 3 2
On-State Resistance (Max) 155Ohm 4.5Ohm
Channel-to-Channel Matching (ΔRon) 5Ohm 120mOhm
Voltage - Supply, Single (V+) 3V ~ 15V 3.3V ~ 16V
Voltage - Supply, Dual (V±) - ±3.3V ~ 8V
Switch Time (Ton, Toff) (Max) - 94ns, 93ns
-3db Bandwidth 70MHz 78MHz
Charge Injection - 29pC
Channel Capacitance (CS(off), CD(off)) 7.5pF 19pF, 59pF
Current - Leakage (IS(off)) (Max) 200nA 100pA
Crosstalk -50dB @ 1MHz -64dB @ 1MHz
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 16-DIP 16-LFCSP-WQ (3x3)
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