LM3S1811-IBZ50-C5 vs LM3S1811-IBZ50-C1

This detailed comparison of LM3S1811-IBZ50-C5 and LM3S1811-IBZ50-C1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LM3S1811-IBZ50-C5

LM3S1811-IBZ50-C5

Texas Instruments

LM3S1811-IBZ50-C1

LM3S1811-IBZ50-C1

Texas Instruments

Specifications
Manufacturer Texas Instruments Texas Instruments
Package / Case 108-LFBGA 108-LFBGA
Description IC MCU 32BIT 256KB FLASH 108BGA IC MCU 32BIT 256KB FLASH 108BGA
In Stock 4 926 3 166
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Stellaris® ARM® Cortex®-M3S 1000 Stellaris® ARM® Cortex®-M3S 1000
Package Tray Tray
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit 32-Bit
Speed 50MHz 50MHz
Connectivity EBI/EMI, I²C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART EBI/EMI, I²C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 67 67
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 1.08V ~ 3.6V 1.08V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 108-BGA (10x10) 108-BGA (10x10)
Part Number Manufacturer Description Request For Quote
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ATMEGA8L-8AI Roving Networks / Microchip Technology IC MCU 8BIT 8KB FLASH 32TQFP
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PIC18LF13K22-E/ML Roving Networks / Microchip Technology IC MCU 8BIT 8KB FLASH 20QFN
DSPIC33EP128GP502-H/SS Roving Networks / Microchip Technology IC MCU 16BIT 128KB FLASH 28SSOP
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