LPC1113FHN33/302:5 vs LPC1113FHN33/201,5

This detailed comparison of LPC1113FHN33/302:5 and LPC1113FHN33/201,5 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1113FHN33/302:5

NXP Semiconductors

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LPC1113FHN33/201,5

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	32-VQFN Exposed Pad	32-VQFN Exposed Pad
Description	IC MCU 32BIT 24KB FLASH 32HVQFN	IC MCU 32BIT 24KB FLASH 32HVQFN
In Stock	2 290	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC1100L	LPC1100
Package	Tape & Reel (TR)	Tray
Core Processor	ARM® Cortex®-M0	ARM® Cortex®-M0
Core Size	32-Bit	32-Bit
Speed	50MHz	50MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT	Brown-out Detect/Reset, POR, WDT
Number of I/O	28	28
Program Memory Size	24KB (24K x 8)	24KB (24K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	32-HVQFN (7x7)	32-HVQFN (7x7)