LPC1114FHN33/302K vs LPC1114FHI33/303K

This detailed comparison of LPC1114FHN33/302K and LPC1114FHI33/303K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1114FHN33/302K

LPC1114FHN33/302K

NXP Semiconductors

LPC1114FHI33/303K

LPC1114FHI33/303K

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Description IC MCU 32BIT 32KB FLASH 32HVQFN IC MCU 32BIT 32KB FLASH 32HVQFN
In Stock 2 111 3 940
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series LPC1100L LPC1100XL
Package Tray Tray
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit 32-Bit
Speed 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b SAR A/D 8x10b SAR
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7)
Part Number Manufacturer Description Request For Quote
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