LPC18S50FET256,551 vs LPC18S57JET256E

This detailed comparison of LPC18S50FET256,551 and LPC18S57JET256E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC18S50FET256,551

NXP Semiconductors

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LPC18S57JET256E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	256-LBGA	256-LBGA
Description	IC MCU 32BIT ROMLESS 256LBGA	IC MCU 32BIT 1MB FLASH 256LBGA
In Stock	10	1 448
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC18xx	LPC18xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	164	164
Program Memory Size	-	1MB (1M x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	-
RAM Size	200K x 8	136K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 8x10b; D/A 1x10b	A/D 8x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	256-LBGA (17x17)	256-LBGA (17x17)