LPC2138FHN64/01,55 vs LPC2138FHN64,557

This detailed comparison of LPC2138FHN64/01,55 and LPC2138FHN64,557 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2138FHN64/01,55

NXP Semiconductors

Request For Quote

LPC2138FHN64,557

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 16/32B 512KB FLSH 64HVQFN	IC MCU 16/32B 512KB FLSH 64HVQFN
In Stock	0	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	LPC2100	LPC2100
Package	Tray	Tray
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	60MHz	60MHz
Connectivity	I²C, Microwire, SPI, SSI, SSP, UART/USART	I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	47	47
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	32K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 16x10b; D/A 1x10b	A/D 16x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-HVQFN (9x9)	64-HVQFN (9x9)