LPC2290FBD144,551 vs LPC2290FBD144/01,5

This detailed comparison of LPC2290FBD144,551 and LPC2290FBD144/01,5 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2290FBD144,551

NXP Semiconductors

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LPC2290FBD144/01,5

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	144-LQFP	144-LQFP
Description	IC MCU 16/32BIT ROMLESS 144LQFP	IC MCU 16/32BIT ROMLESS 144LQFP
In Stock	0	60
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Not For New Designs
Series	LPC2200	LPC2200
Package	Tray	Tray
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	60MHz	60MHz
Connectivity	CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART	CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals	PWM, WDT	PWM, WDT
Number of I/O	76	76
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	16K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.65V ~ 3.6V	1.65V ~ 3.6V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-LQFP (20x20)	144-LQFP (20x20)