LPC2366FBD100/CP3298551 vs LPC2364HBD100,551

This detailed comparison of LPC2366FBD100/CP3298551 and LPC2364HBD100,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2366FBD100/CP3298551

VIGOR

Request For Quote

LPC2364HBD100,551

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	100-LQFP	100-LQFP
Description	LPC2300 - ARM7, 32-BIT RISC MICR	IC MCU 16/32B 128KB FLSH 100LQFP
In Stock	5 169	20
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Not For New Designs
Series	LPC2300	LPC2300
Package	Bulk	Tray
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	72MHz	72MHz
Connectivity	CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB	CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	70	70
Program Memory Size	256KB (256K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	58K x 8	34K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 6x10b; D/A 1x10b	A/D 6x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	100-LQFP (14x14)	100-LQFP (14x14)