LPC2470FET208,551 vs LPC2478FET208,551

This detailed comparison of LPC2470FET208,551 and LPC2478FET208,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2470FET208,551

NXP Semiconductors

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LPC2478FET208,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	208-TFBGA	208-TFBGA
Description	IC MCU 16/32BIT ROMLESS 208TFBGA	IC MCU 16/32BIT 512KB 208TFBGA
In Stock	117	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Not For New Designs
Series	LPC2400	LPC2400
Package	Tray	Tray
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	72MHz	72MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	160	160
Program Memory Size	-	512KB (512K x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	-
RAM Size	98K x 8	96K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 8x10b; D/A 1x10b	A/D 8x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	208-TFBGA (15x15)	208-TFBGA (15x15)