LPC2917FBD144,551 vs LPC2919FBD144/01/,

This detailed comparison of LPC2917FBD144,551 and LPC2919FBD144/01/, in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2917FBD144,551

NXP Semiconductors

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LPC2919FBD144/01/,

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	144-LQFP	144-LQFP
Description	IC MCU 16/32B 512KB FLSH 144LQFP	IC MCU 16/32B 768KB FLSH 144LQFP
In Stock	0	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	LPC2900	LPC2900
Package	Tray	Tray
Core Processor	ARM9®	ARM9®
Core Size	16/32-Bit	16/32-Bit
Speed	80MHz	80MHz
Connectivity	CANbus, EBI/EMI, LINbus, SPI, UART/USART	CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	108	108
Program Memory Size	512KB (512K x 8)	768KB (768K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	80K x 8	80K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-LQFP (20x20)	144-LQFP (20x20)