LPC2926FBD144,551 vs LPC2926FBD144,557

This detailed comparison of LPC2926FBD144,551 and LPC2926FBD144,557 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2926FBD144,551

NXP Semiconductors

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LPC2926FBD144,557

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	144-LQFP	144-LQFP
Description	IC MCU 16/32B 256KB FLSH 144LQFP	IC MCU 16/32B 256KB FLSH 144LQFP
In Stock	0	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Not For New Designs
Series	LPC2900	LPC2900
Package	Tray	Tray
Core Processor	ARM9®	ARM9®
Core Size	16/32-Bit	16/32-Bit
Speed	125MHz	125MHz
Connectivity	CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB	CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals	DMA, POR, PWM, WDT	DMA, POR, PWM, WDT
Number of I/O	104	104
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	16K x 8	16K x 8
RAM Size	56K x 8	56K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 24x10b	A/D 24x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-LQFP (20x20)	144-LQFP (20x20)