LPC3141FET180,551 vs LPC3143FET180,551

This detailed comparison of LPC3141FET180,551 and LPC3143FET180,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC3141FET180,551

VIGOR

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LPC3143FET180,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	180-TFBGA	180-TFBGA
Description	IC MCU 16/32BIT ROMLESS 180TFBGA	IC MCU 16/32BIT ROMLESS 180TFBGA
In Stock	0	36
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Not For New Designs
Series	LPC3100	LPC3100
Package	Tray	Tray
Core Processor	ARM9®	ARM926EJ-S
Core Size	16/32-Bit	16/32-Bit
Speed	270MHz	270MHz
Connectivity	EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG	EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals	DMA, I²S, LCD, PWM, WDT	DMA, I²S, LCD, PWM, WDT
Number of I/O	20	20
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	192K x 8	192K x 8
Voltage - Supply (Vcc/Vdd)	1.2V ~ 1.3V	1.1V ~ 3.6V
Data Converters	A/D 4x10b	A/D 4x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	180-TFBGA (12x12)	180-TFBGA (12x12)