LPC3152FET208,551 vs LPC3154FET208,551

This detailed comparison of LPC3152FET208,551 and LPC3154FET208,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC3152FET208,551

VIGOR

Request For Quote

LPC3154FET208,551

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	208-TFBGA	208-TFBGA
Description	IC MCU 16/32BIT ROMLESS 208TFBGA	IC MCU 16/32BIT ROMLESS 208TFBGA
In Stock	10 493	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	LPC3100	LPC3100
Package	Tray	Tray
Core Processor	ARM9®	ARM9®
Core Size	16/32-Bit	16/32-Bit
Speed	180MHz	180MHz
Connectivity	EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG	EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals	DMA, I²S, LCD, PWM, WDT	DMA, I²S, LCD, PWM, WDT
Number of I/O	10	10
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	192K x 8	192K x 8
Voltage - Supply (Vcc/Vdd)	1.1V ~ 3.6V	1.1V ~ 3.6V
Data Converters	A/D 3x10b	A/D 3x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	208-TFBGA (12x12)	208-TFBGA (12x12)