LPC55S06JBD64E vs LPC5506JBD64E

This detailed comparison of LPC55S06JBD64E and LPC5506JBD64E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC55S06JBD64E

NXP Semiconductors

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LPC5506JBD64E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	64-TQFP Exposed Pad	64-TQFP Exposed Pad
Description	IC MCU CORTEX M33 HTQFP61	IC MCU CORTEX M33 HTQFP60
In Stock	160	130
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC55S0x	-
Package	Tray	Tray
Core Processor	ARM® Cortex®-M33	ARM® Cortex®-M33
Core Size	32-Bit	32-Bit
Speed	96MHz	96MHz
Connectivity	CANbus, Flex COMM, I²C, SPI, UART/USART	CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O	45	45
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	96K x 8	96K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 9x16b SAR	A/D 9x16b SAR
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	64-HTQFP (10x10)	64-HTQFP (10x10)